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聚合物微流控芯片基片与盖片一体化注塑成型模具

Release Time:2019-03-09  Hits:

First Author: 宋满仓

Disigner of the Invention: Chong Liu,Minjie wang,杜立群,庞中华,连城林

Application Number: CN201110072477.7

Authorization Date: 2011-03-24

Authorization Number: CN102205602A

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