Release Time:2019-03-09 Hits:
First Author: 祝铁丽
Disigner of the Invention: 刘克成,刘莹,宋满仓,王学虎,余祖元
Application Number: CN200910312630.1
Authorization Date: 2009-12-30
Authorization Number: CN101786334A
Prev One:一种微流控芯片注塑成型模具
Next One:一种微流控芯片热流道注塑成型模具