宋满仓

个人信息Personal Information

副教授

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:机械工程学院

学科:机械制造及其自动化

办公地点:知方楼7136

电子邮箱:mcsong@dlut.edu.cn

扫描关注

论文成果

当前位置: 中文主页 >> 科学研究 >> 论文成果

Quality defects and analysis of the microfluidic chip injection molding

点击次数:

论文类型:期刊论文

发表时间:2009-09-21

发表刊物:Materials Science Forum

收录刊物:EI、CPCI-S、Scopus

卷号:628 629

页面范围:417-422

ISSN号:0878493123

关键字:Microfluidic chip; injection molding; defect; molding quality

摘要:Compared with hot embossing, microfluidic chips injection molding is higher efficiency process and more suitable for mass production, but the quality control for injection molding is much more complex. Experiments indicate that the incomplete replication of the micro-channel and the sink mark for microfluidic chips are the chief defects to the molding. Simulation and theoretical analysis show that the stagnant flow of the melt in micro-channel and the shrinkage difference of the chips in different directions are the main reasons for molding defect. A set of new methods that how to control process parameter, design mold, and select polymer material is proposed to reduce or avoid the defects. © (2009) Trans Tech Publications, Switzerland.