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个人信息Personal Information
副教授
硕士生导师
性别：男
出生日期：1965-06-03
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料无损检测与评价
办公地点：大连理工大学材料馆230房间
联系方式：0411-84707117
电子邮箱：chenjun@dlut.edu.cn
INVESTIGATIONS ON VOID MORPHOLOGY IN CFRP COMPOSITE MATERIALS AND ULTRASONIC SCATTERING ATTENUATION BASED ON A 2D RANDOM VOID MODEL
点击次数：
论文类型：会议论文
发表时间：2012-01-01
收录刊物：CPCI-S、Scopus
卷号：1430
期号：31
页面范围：1072-1079
关键字：Void; Morphology; Ultrasonic Scattering Attenuation; Random Void Model
摘要：A 2D random void model (RVM) is proposed to describe voids morphology in Carbon Fiber Reinforced Plastic (CFRP) composite materials and used to investigate Ultrasonic Scattering Attenuation Coefficient (USAC). Void morphology simulations from RVM present good matches to micrographic observations. The fluctuations of USAC due to the randomness of void morphology and their dependence on the frequency have been discussed, which are significantly helpful to clarify ultrasonic scattering attenuation mechanism from voids in nature.