点击次数：

论文类型：期刊论文

发表时间：2018-03-01

发表刊物：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

收录刊物：SCIE、EI

卷号：29

期号：6

页面范围：4383-4390

ISSN号：0957-4522

摘要：In this research, the shielding effect of Ag3Sn particles on Cu6Sn5 grain boundaries in isothermal heating and cooling of multiple reflows was investigated in Sn/Cu and Sn3.5Ag/Cu solder bumps by utilizing the real-time imaging technology of Shanghai Synchrotron Radiation Facility as well as scanning electron microscope. Results show that controlled by volume diffusion growth mechanism, the value of time exponent n for Sn is much closer to 1/2 with increasing reflow cycle than for Sn3.5Ag that governed by both grain boundary and volume diffusion mechanisms in isothermal heating. Consequently, IMC increment in Sn3.5Ag is larger than in Sn due to the Cu supplement effect of J(*) (in-b) in cooling during multiple reflows. The reason for the phenomena may be the shielding effect of Ag3Sn nano particles on grain boundaries in Sn3.5Ag during multiple reflow process.