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论文类型：期刊论文

发表时间：2012-02-01

发表刊物：MATERIALS RESEARCH INNOVATIONS

收录刊物：SCIE、EI、Scopus

卷号：16

期号：1

页面范围：51-55

ISSN号：1432-8917

关键字：Al/Mg compound materials; Interface; Microstructure

摘要：Al/Mg compound materials were fabricated by a solid-liquid bonding method. The well bonded interface with a transition layer can be obtained. There were two kinds of interface structures in the ingot. The microstructures and bonding properties of Al/Mg interface were studied. The results showed that the brittle interface layer was composed mainly of intermetallic compound Al(12)Mg(17) and Al(3)Mg(2) at the top part and Al(3)Mg(2) at the bottom part of ingot respectively. The reason why two kinds of interface structures existed was explained.