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基于IMC芯片的仪表高密度集成设计与模块开发

Release Time:2021-01-29  Hits:

Leading Scientist: 解永平

Project Participants: 董维杰

Project Source: 科技部重大专项

Sub-Class of Project: Manufacturing Basic Technologies and Key Components

Status: 结题

Supported by: Chongqing University of Posts and Telecommunications

Nature of Project: 纵向

Project Approval Number: 2019YFB2005903

Date of Project Approval: 2020-01-01

Scheduled Completion Time: 2022-12-31

Date of Project Initiation: 2020-01-01

Date of Project Completion: 2024-10-16

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