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辛体系下平面热黏弹性圣维南问题的解析解

Release Time:2019-03-10  Hits:

Indexed by: Journal Article

Date of Publication: 2008-08-08

Journal: 力学与实践

Included Journals: CSCD、ISTIC、PKU

Volume: 30

Issue: 4

Page Number: 76-78,38

ISSN: 1000-0879

Key Words: 辛体系 热黏弹性 本征值 本征解

Abstract: 借助积分变换,将辛体系引入平面热黏弹性问题,建立了基本问题的对偶方程,并将全部圣维南问题归结为满足共轭辛正交关系的零本征值本征解问题.同时,利用变量代换和本征解展开等技术给出了一套求解边界条件问题的具体方法.算例讨论了几种典型边界条件问题,描述了热黏弹性材料的蠕变和松弛特征,体现了这种辛方法的有效性.

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