孙伟

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:机械工程学院

办公地点:机械东楼

电子邮箱:sunwei@dlut.edu.cn

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Development of a dynamic constitutive model with particle damage and thermal softening for Al/SiCp composites

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论文类型:期刊论文

发表时间:2020-03-15

发表刊物:COMPOSITE STRUCTURES

收录刊物:EI、SCIE

卷号:236

ISSN号:0263-8223

关键字:Al/SiCp composites; Constitutive model; Particle damage; Thermal softening; Dynamic compression

摘要:A dynamic constitutive model of Al/SiCp composites can not only promote the application of composites in frontier fields, but also guarantee the reliability of the simulation modeling and analytical modeling of the composites. However, the influence of particles damage and thermal softening has not been considered in the dynamic constitutive model of Al/SiCp composites established so far. Therefore, a dynamic constitutive model of Al/SiCp composites with particle damage and thermal softening was established based on the Weibull statistical distribution, the Eshelby equivalent inclusion method, and the constitutive relation of the Al matrix. Then, this dynamic constitutive model was verified. The verification results indicated that the dynamic constitutive model with particle damage and thermal softening was able to predict the dynamic compressive behavior of various Al/SiCp composites accurately. In addition, theoretical calculations of the parameters of the dynamic constitutive model were analyzed to reveal the effect of particle damage and thermal softening on the dynamic compressive behavior. The result shows that an increase in the probability of particle damage in Al/SiCp composites reduces the strengthening effect of the particles. An increase in temperature enhances the fluidity of the matrix, and the dynamic compressive behavior of the Al/SiCp composite gradually became closer to those of tough matrix materials.