Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2010-08-27

Journal: JOURNAL OF ALLOYS AND COMPOUNDS

Included Journals: SCIE

Volume: 505

Issue: 1

Page Number: 179-182

ISSN: 0925-8388

Key Words: Cu-Ni; Cluster-plus-glue-atom model; Corrosion

Abstract: Minor M (M = Fe, Mn, Cr) additions are widely added to enhance the corrosion resistance of commercial cupronickel alloys. The present paper aims at optimizing the amounts of M in Cu-70(Ni,Fe,Mn,Cr)(30) (at.%) alloys using a cluster-plus-glue-atom model for stable solid solutions. By this model, it assumed that 1 M atom and 12 Ni atoms formed an M-centered and Ni-surrounded cube-octahedron cluster and the isolated M1Ni12 clusters are embedded in a Cu matrix, conforming to a cluster formula [M1Ni12]Cu-30.3 = [Mu(1/13)Ni(12/13)](30)Cu-70. A structure of this kind satisfies ideally the nearest neighbor requirement, i.e. only M-Ni and Ni-Cu neighbors are allowed and the unfavorable Cu-M pairs are avoided, and hence it describes a stable solid solution structure with good thermal stability. Electrochemical corrosion measurements indicated that [(Fe0.6Mn0.25Cr0.15)(1)Ni-12]Cu-30.3 had the best corrosion resistance in 3.5% NaCl aqueous solution. (C) 2010 Elsevier B.V. All rights reserved.