Release Time:2019-03-09 Hits:
First Author: 羌建兵
Disigner of the Invention: 董闯,王清,王英敏
Authorization Number: ZL2010 1 02593926.8
Prev One:锌基合金真空离子镀铬工艺代替现行电镀铬工艺
Next One:一种低Nb含量的生物医用b-钛合金