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Indexed by:会议论文

Date of Publication:2009-08-10

Included Journals:EI、CPCI-S、Scopus

Page Number:810-813

Abstract:The effects of 0.3 wt.% Zn and 1 wt.% Zn addition on the melting point, the microstructure and the shear strength of Sn-0.7Cu were investigated. With small amount of Zn addition, the melting point decreased a little, and refined microstructure was observed especially for Sn-0.7Cu-1Zn and the fraction of eutectic region increased. Cu-Zn intermetallic compounds (IMCs) were detected in Sn-0.7Cu-1Zn at the phase boundary between beta-Sn and eutectic region. Shear strength of solders increased with strain rate lineally in log-log plot. The strength of Sn-0.7Cu-1Zn was much higher than that of Sn-0.7Cu, which was similar to that of Sn-0.7Cu-0.3Zn. Ductile fracture was observed in all solders.