Release Time:2019-03-11  Hits:

Indexed by: Conference Paper

Date of Publication: 2009-01-01

Included Journals: CPCI-S

Page Number: 501-506

Key Words: Solder; Joint; Corrosion behavior; Lead-free; Corrosion solution; Dissolution amount

Abstract: The corrosion resistance of three solders, Sn-Pb, Sn-9Zn, Sn-3.5Ag-0.5Cu, and their soldering joints were investigated in 3.5% NaCl, pH = 10 NaOH and pH = 4 H2SO4 solution, respectively. The microstructure and composition of the corrosion products were analyzed by SEM and X-ray diffraction (XRD) to identify the corrosion products from the different solder materials after dissolution tests. Whether solder or joint, Sn-3.5Ag-0.5Cu exhibit much better corrosion resistance than Sn-37Pb and Sn-9Zn in NaOH and H2SO4 solution. While the corrosion resistance of Sn-3.5Ag-0.5Cu joint in NaCl saline solution is the worst among all of the tests.