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Room temperature creep and its effect on fatigue crack growth in a X70 steel with various microstructures

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Indexed by:会议论文

Date of Publication:2006-11-22

Included Journals:EI、CPCI-S

Volume:353-358

Issue:PART 1

Page Number:138-141

Key Words:room temperature creep; fatigue crack growth; single wave overload; the X70 steel; crack closure

Abstract:Fatigue crack growth (FCG) tests have been performed in an X70 steel with various microstructures (respectively in the as-received and the normalized condition). The effect of room temperature creep (RTC) on FCG behavior has been investigated by comparing with single wave overloads (SWOL). The as-received X70 pipeline steel has high FCG rate at the near-threshold region. While at the Paris region, FCG rate seems insensitive to the microstructure. In both conditions, time-dependent deformation is observed at crack tips (i.e., RTC), which increases with increasing stress-intensity-factor. And this deformation has a high value in the normalized state, under identical testing conditions. Both RTC and SWOL can bring subsequent fatigue crack growth a very short initial acceleration before deceleration, whereas the former induces more serious deceleration and retardation, which attributes to more significant crack closures.

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