Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2011-06-01

Journal: JOURNAL OF MATERIALS RESEARCH

Included Journals: EI、SCIE、Scopus

Volume: 26

Issue: 12

Page Number: 1468-1471

ISSN: 0884-2914

Abstract: The formation of interfacial eta'-Cu6Sn5 in Sn-0.7Cu/Cu solder joints at different aging temperatures was studied using x-ray diffraction (XRD). The time-temperature-formation curve was obtained and is discussed based on the phase transformation from existing eta-Cu6Sn5 and interfacial reaction at temperatures below 186 degrees C. A minimum formation time was observed in the temperature range of 135-150 degrees C.