Hits:

Indexed by:期刊论文

Date of Publication:2011-06-01

Journal:JOURNAL OF MATERIALS RESEARCH

Included Journals:Scopus、SCIE、EI

Volume:26

Issue:12

Page Number:1468-1471

ISSN No.:0884-2914

Abstract:The formation of interfacial eta'-Cu6Sn5 in Sn-0.7Cu/Cu solder joints at different aging temperatures was studied using x-ray diffraction (XRD). The time-temperature-formation curve was obtained and is discussed based on the phase transformation from existing eta-Cu6Sn5 and interfacial reaction at temperatures below 186 degrees C. A minimum formation time was observed in the temperature range of 135-150 degrees C.