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Indexed by:期刊论文

Date of Publication:2010-06-18

Journal:JOURNAL OF ALLOYS AND COMPOUNDS

Included Journals:SCIE、EI

Volume:500

Issue:1

Page Number:39-45

ISSN No.:0925-8388

Key Words:Sn-Ag-Cu; Zn; Ag3Sn; (Cu,Ag)(5)Zn-8; Cooling rate

Abstract:Two mechanisms to inhibit Ag3Sn plates were discovered in Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu with 1 wt.% Zn addition. It was revealed that 1 wt.% Zn not only reduced the supercooling of beta-Sn, but also promoted the formation of gamma-(Cu,Ag)(5)Zn-8 compounds. The amount of gamma-(Cu,Ag)(5)Zn-8 was larger in Sn-3.0Ag-0.5Cu than that in Sn-1.0Ag-0.5Cu. Meanwhile, the Ag content in gamma-(Cu,Ag)(5)Zn-8 was higher in the high-Ag solder. Although more gamma particles formed under slow cooling rate, the Ag content varied a little with cooling rate. (C) 2010 Elsevier B.V. All rights reserved.