Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2010-06-18

Journal: JOURNAL OF ALLOYS AND COMPOUNDS

Included Journals: EI、SCIE

Volume: 500

Issue: 1

Page Number: 39-45

ISSN: 0925-8388

Key Words: Sn-Ag-Cu; Zn; Ag3Sn; (Cu,Ag)(5)Zn-8; Cooling rate

Abstract: Two mechanisms to inhibit Ag3Sn plates were discovered in Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu with 1 wt.% Zn addition. It was revealed that 1 wt.% Zn not only reduced the supercooling of beta-Sn, but also promoted the formation of gamma-(Cu,Ag)(5)Zn-8 compounds. The amount of gamma-(Cu,Ag)(5)Zn-8 was larger in Sn-3.0Ag-0.5Cu than that in Sn-1.0Ag-0.5Cu. Meanwhile, the Ag content in gamma-(Cu,Ag)(5)Zn-8 was higher in the high-Ag solder. Although more gamma particles formed under slow cooling rate, the Ag content varied a little with cooling rate. (C) 2010 Elsevier B.V. All rights reserved.