Current position: Home >> Scientific Research >> Patents

一种金属间化合物填充的三维封装垂直通孔及其制备方法

Hits:

First Author:Zhao Ning

Disigner of the Invention:Mingliang Huang,Zhao Jie

Authorization number:ZL201510069933.0

Pre One:金属间化合物薄膜的制备方法

Next One:一种测定微电子封装焊点压缩蠕变性能的测试装置
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep