Release Time:2019-10-22 Hits:
First Author: 赵杰
Disigner of the Invention: Mingliang Huang,马海涛,王来,冯炜,邢丽
Application Number: CN200810228966.5
Authorization Date: 2008-11-18
Authorization Number: CN101482464
Prev One:锡锌铜镍无铅钎料合金
Next One:一种测定微电子封装焊点压缩蠕变性能的测试装置