学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Tensile behavior of Sn-0.7Cu with Zn addition at various deformation temperatures
点击次数：
论文类型：期刊论文
发表时间：2011-04-01
发表刊物：7th China-Japan Bilateral Symposium on High Temperature Strength of Materials
收录刊物：SCIE、EI、CPCI-S、Scopus
卷号：24
期号：2
页面范围：155-160
ISSN号：1006-7191
关键字：Sn-0.7Cu; Zn; Tensile; Temperature; Strength; Ductility; Fracture
摘要：The tensile behavior of Sn-0.7Cu and Sn-0.7Cu-1Zn was compared at various deformation temperatures. Refined microstructure and gamma-CuZn particles were discovered with Zn addition. The strengths of Zn-containing solder were higher than that of Sn-0.7Cu at room and subzero temperatures. With the elevation of deformation temperature, they both decreased and they were nearly the same at 80 degrees C. The works of fracture exhibited the similar evolution law. For Sn-0.7Cu solder, the elongation after fracture was smaller and the reduction of area was bigger than those of Sn-0.7Cu-1Zn. This shows that Zn addition improved the deformation stability, which is attributed to the modification of the microstructure. Dimples in fracture surface became smaller and shallower with the decreasing temperature. Ductile fracture was discovered in all the samples.
发表时间：2011-04-01
