学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Corrosion of Sn-0.75Cu Solder and Sn-0.75Cu/Cu Joint in Salt Solutions
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论文类型：会议论文
发表时间：2011-08-08
收录刊物：EI、CPCI-S、Scopus
页面范围：917-920
关键字：Corrosion; Solder alloy; Joint; Leaching behavior; Salt solutions
摘要：The corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl, 1%NaCl-2%Na2SO4 and 1%NaCl-0.6%Na2SO4-3%Na2CO3 solutions were investigated using leaching test. The leaching of Sn from the solder in 1%NaCl-0.6%Na2SO4-3%Na2CO3 solution was relatively serious, compared to that in the other two solutions. The amount of Sn leached from the joint was the largest in NaCl solution. Loosen corroded products formed on the surfaces of the solder or joint where a large amount of Sn leached. The XRD results showed that the corrosion products were mainly composed of SnO, SnO2 and Sn4(OH)6Cl2. The potentiodynamic polarization tests suggested that the galvanic corrosion which formed between solder alloys and Cu substrate was the main reason for the above differences.
发表时间：2011-08-08
