学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
eta-eta' Transformation of Interfacial Cu6Sn5 in Solder Joints
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论文类型：会议论文
发表时间：2010-01-01
收录刊物：EI、CPCI-S、Scopus
页面范围：1097-1101
摘要：The eta-eta' transformation of interfacial Cu6Sn5 in solder joints was studied. Two cooling rates were selected to obtain different grain sizes of intermetallic compounds (IMCs). In the case of air cooling, the compounds were tiny and no eta-eta' transformation was detected in the as-soldered state. Under furnace cooling, however, thick and coarse interfacial IMCs were obtained and eta was still stable. After aging 2d at 150 degrees C, eta-eta' transformation was detected no matter what cooling rate. This indicates that effects of IMC thickness and grain size are negligible in some way. It is also shown that aging at 150 degrees C. promoted the interfacial eta-eta' transformation and the time needed was comparatively short to that of long-term aging study of solid/solid growth kinetics. These provide us a significant reference to understand the obtained reliability data and evaluate the possible threats of transformation to the interconnects. For Ni-bearing solder joints, interfacial (Cu, Ni)(6)Sn-5 was detected. Only eta-phase was discovered after soldering and aging.
发表时间：2010-01-01
