学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Shear strength of Sn-3.5Ag solder and Sn-3.5Ag/Cu joint
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论文类型：会议论文
发表时间：2009-01-01
收录刊物：CPCI-S
页面范围：511-515
关键字：Sn-3.5Ag; Sn-3.5Ag/Cu; Strain sensitivity; Shear; Fracture
摘要：The multiscale microstructures and shear properties of Sn-3.5Ag at different cooling rates and Sn-3.5Ag/Cu joint have been studied. Results show that when the cooling rate decreased from 3.5K/s to 1.0K/s, short-needlelike bulk Ag(3)Sn intermetallic compounds (IMCs) formed and dispersed homogeneously in matrix. Simultaneously, eutectic region was refined. Linear increasing relationship on log-log plot was obtained between shear strength and shear strain rate for all samples. The shear strength of Sn-3.5Ag solder at fast cooling rate was higher than that at a slow cooling rate, but both were smaller than that of joint. The strain sensitivity exponent m for bulk solders at 1.0K/s, 3.5K/s and joint was 0.094, 0.076 and 0.082, respectively. Fractography analysis indicated all the solder samples, and Sn-3.5Ag/Cu joint at low strain rates (0.1rad/s and 1rad/s), exhibited ductile fracture no matter what cooling rate. At high strain rate (10rad/s), broken Cu(6)Sn(5) were found in the fractography of Sn-3.5Ag/Cu joint. However, the main part of the fractography was still composed of dimples, which indicated mixed fracture happened.
发表时间：2009-01-01
