学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Leaching behavior of lead-free solders in a NaCl-Na2SO4-Na2Co3 mixed solution as simulated soil
点击次数：
论文类型：期刊论文
发表时间：2011-01-01
发表刊物：Journal of the Chinese Society of Corrosion and Protection
收录刊物：PKU、ISTIC、Scopus
卷号：31
期号：4
页面范围：381-384+388
ISSN号：10054537
摘要：Leaching behavior of Sn-3.5Ag-0.75Cu and Sn-0.75Cu lead-free solder alloys in a NaCl-na2so4- na2co3 mixed solution as simulated soil was investigated and compared with that of Sn-37Pb alloy. The results showed that leaching amount of Sn from the three solders increased with reaction period. The most leaching amount of Sn was found for Sn-0.7Cu solder alloy. However, Sn leached from Sn-3.5Ag-0.75Cu solder alloy was depressed by adding Ag element. The leaching amount of Ag, Cu and Pb elements also increased linearly with increasing time. However, the relatively less amount of leached Ag and Cu was measured. The product on the leached solder alloy surface was identified as Sn4 (OH) 6Cl2 and SnO. Many cracks and pits were found in the product on Sn-0.75Cu alloy surface, while the product layer on Sn-3.5Ag-0.75Cu alloy was rather compact. For Sn-37Pb alloy, some product had spalled from the surface. Based on the experimental results, it was supposed that the phase formation and morphology of surface product were responsible for the difference of leaching kinetics for these three solder alloys.
发表时间：2011-01-01
