学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
The growth behavior of inteimetallic compound layers of Sn-3Ag/Cu and Sn/Cu joints during soldering and aging
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论文类型：会议论文
发表时间：2006-01-01
收录刊物：CPCI-S
页面范围：12-+
摘要：The growth behaviors of Sn-3Ag/Cu and Sn/Cu IMC layers during soldering and aging have been investigated. In the soldering experiments, both the Sn-3Ag/Cu and Sn/Cu were soldered at 270 degrees C for different time. In the aging experiments, the Sn-3Ag/Cu and Sn/Cu joints were firstly soldered at 270 degrees C for 60s, and aged at 120 degrees C, 170 degrees C, 190 degrees C for various time. Then all the samples were observed under scanning electron microscopy (SEM). The average thickness of IMC layers was measured by using Q500IW image analysis meter. The results indicated that in the soldering the growth rate of Sn-3Ag/Cu IMC layers was faster than that of Sn/Cu. However, in the aging the growth rate of Sn-3Ag/Cu IMC layers was lower than that of Sn/Cu. The activation energies of Sn-3Ag/Cu and Sn/Cu IMC layers in the aging were about 90KJ/mol and 52KJ/mol respectively.
发表时间：2006-01-01
