学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Effect of Bi on the kinetics of intermetallics growth in Sn-3Ag-0.5Cu/Cu solder joint
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论文类型：会议论文
发表时间：2006-06-27
收录刊物：EI、CPCI-S、Scopus
页面范围：59-+
摘要：Three lead-free solder alloys, Sn-3Ag-0.5Cu, Sn-3Ag0.5Cu-1Bi and Sn-3Ag-0.5Cu-3Bi, were used in the current experiments to investigated the microstructural evolution as well as the kinetics of intermetallic compound(IMC) layer growth. The experimental results indicated that the thickness of Cu6Sn5 intermetallic layer, at the solder/Cu interface increases with aging temperature, while the growth rate of IMC in Sn-3Ag0.5Cu-3Bi/Cu joints is slower than that in Sn-3Ag-0.5Cu1Bi/Cu joints and Sn-Ag-Cu solder joints. The effect of Bi element is attributed to the accumulation of Bi near the joint and the enhancement of the activation energy by the addition of Bi.
发表时间：2006-06-27
