学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1 wt.% Zn addition
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论文类型：期刊论文
发表时间：2010-06-18
发表刊物：JOURNAL OF ALLOYS AND COMPOUNDS
收录刊物：SCIE、EI
卷号：500
期号：1
页面范围：39-45
ISSN号：0925-8388
关键字：Sn-Ag-Cu; Zn; Ag3Sn; (Cu,Ag)(5)Zn-8; Cooling rate
摘要：Two mechanisms to inhibit Ag3Sn plates were discovered in Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu with 1 wt.% Zn addition. It was revealed that 1 wt.% Zn not only reduced the supercooling of beta-Sn, but also promoted the formation of gamma-(Cu,Ag)(5)Zn-8 compounds. The amount of gamma-(Cu,Ag)(5)Zn-8 was larger in Sn-3.0Ag-0.5Cu than that in Sn-1.0Ag-0.5Cu. Meanwhile, the Ag content in gamma-(Cu,Ag)(5)Zn-8 was higher in the high-Ag solder. Although more gamma particles formed under slow cooling rate, the Ag content varied a little with cooling rate. (C) 2010 Elsevier B.V. All rights reserved.
发表时间：2010-06-18
