学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field
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论文类型：期刊论文
发表时间：2010-02-01
发表刊物：JOURNAL OF MATERIALS RESEARCH
收录刊物：SCIE、EI
卷号：25
期号：2
页面范围：359-367
ISSN号：0884-2914
摘要：The kinetics of intermetallic compound (IMC) layer and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field was experimentally examined. It is found that the IMC layer growth is controlled by flux-driven ripening process. The high magnetic field promotes the growth of IMC layer, retards the dissolution of Cu substrate, and decreases the content of Cu solute at the liquid-IMC interface front. Based on the experimental results, it is considered that the magnetization induced by magnetic field promotes the ripening process for IMC layer growth. The Lorentz force dampening the convection and magnetization decreasing the Cu solubility limit can retard the Cu dissolution and change the solute distribution at the liquid-IMC interface front.
发表时间：2010-02-01
