学位：博士
职称：教授
所在单位：材料科学与工程学院
长期从事金属材料蠕变、组织演化、损伤及寿命预测工作。主持和参加国家自然科学基金重点和面上项目6项，“863”计划课题2项，省部级及企业项目20余项。获国家发明专利5项，发表学术论文200余篇。出版专著“耐热钢持久性能的统计分析及可靠性预测”1部（科学出版社），译著“高温合金”1部，编著1部。获辽宁省教学名师，宝钢教育奖优秀教师奖。辽宁省教学成果一等奖1项，国家本科一流课程、国家精品在线开放课程负责人。Emerald出版社颁发的学术奖“Literati Club Awards for Excellence”，金属学报2009-2015年度优秀论文奖。省部级科技奖励一等奖、二等奖5项。
Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples
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论文类型：期刊论文
发表时间：2009-04-03
发表刊物：JOURNAL OF ALLOYS AND COMPOUNDS
收录刊物：SCIE、EI
卷号：473
期号：1-2
页面范围：382-388
ISSN号：0925-8388
关键字：Kinetics; Intermetallic; Shear strength; Solder
摘要：Three lead-free solder alloys, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1 Bi and Sn-3Ag-0.5Cu-3Bi, have been used to solder with Cu substrate in the current experiments to investigate the influence of Bi on the kinetics of intermetallic compound (IMC) layer growth and shear strength of the soldering couples. The experimental results indicate that the thickness of IMC layer at the solder/Cu interface increases with aging process. The addition of Bi delays the propagation rate of total IMC layer. For the samples aged at 140 degrees C up to 500 h. their shear strengths keep at a relative stable level where the fracture occurs in bulk solder side and the addition of Bi improve the strength level, while for the samples aged at 195 degrees C, the shear strengths decrease continuously with aging time where the fracture occurs along interface between IMC layers and solders and the influence of Bi can be negligible. (C) 2008 Elsevier B.V. All rights reserved.
发表时间：2009-04-03
