点击次数：

论文类型：会议论文

发表时间：2011-12-16

收录刊物：EI、CPCI-S、Scopus

卷号：418-420

页面范围：936-939

关键字：electroless Ni-P plating; AZ91D magnesium alloy; deposition rate; deposition reaction dynamics

摘要：The effects of the concentrations of NiSO4 center dot 6H(2)O, NaH2PO2 center dot H-2 and complexing agents in bath, temperature, pH, SiC concentration etc. on deposition rate of electroless Ni-P plating were systematically studied. The appropriate deposition rate of electroless Ni-P plating (17 mu m h(-1)) was obtained at the optimal conditions. The deposition reaction dynamics of electroless Ni-P plating on AZ91D magnesium alloy was discussed and the corresponding kinetic model was also determined based on the corresponding experimental results.