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Indexed by:期刊论文

Date of Publication:2022-06-29

Journal:机械工程学报

Affiliation of Author(s):机械工程学院

Issue:13

Page Number:202-206

ISSN No.:0577-6686

Abstract:Grinding of polycrystalline diamond (PCD) is an important process in PCD cutter manufacturing. The grinding parameters can strongly influence the removal form of PCD, and determine the performance of the cutting tool. PCD specimens are ground at different grinding conditions and etched using chlorinators acid afterward. Brittle removal mechanism of polycrystalline diamond (PCD), as well as its relation with grinding parameters, is investigated by examining the surface features of pre-etched PCD specimens using scanning electron microscopy. Based on different generation mechanisms, the brittle removal forms of PCD can be classified as micro-cracking, grain-boundary cracking and fatigue-cleavage cracking, and in detail, the micro-cracking form includes cleavage micro-cracking and brittle micro-cracking. Micro-cracking which is the main removal form in the initial stage of wet grinding happens under any grinding condition. Grain-boundary cracking happens when wear particles of diamond wheel are sharp. On the contrary, fatigue-cleavage cracking happens when wear particles of diamond wheel are blunt, especially in the later stages of dry grinding. © 2014 Journal of Mechanical Engineering.

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