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Indexed by:期刊论文

Date of Publication:2012-09-01

Journal:ENGINEERING FRACTURE MECHANICS

Included Journals:SCIE、EI、Scopus

Volume:91

Page Number:103-116

ISSN No.:0013-7944

Key Words:Kirchhoff plate; Interface crack; Analytical singular element; Stress intensity factor; Symplectic duality system

Abstract:By introducing appropriate transformations, a circular sector Kirchhoff plate bending composed of dissimilar materials with both straight sides free is led into symplectic duality system in this paper. The problem is solved by using the symplectic eigenfunction expansion method, and analytical expressions of symplectic eigenvalues and eigensolutions are derived. Using the symplectic eigensolutions as a displacement model, an analytical singular element is developed for the interface crack. Bending stress intensity factors can be determined directly from the expansion coefficients of the eigensolution. Numerical results show that the present method has a high accuracy in the calculation of stress intensity factors. (C) 2012 Elsevier Ltd. All rights reserved.