Current position: Home >> Scientific Research >> Patents

Thin Film of Copper-Nickel-Molybdenum Alloy and Method for Manufacturing the Same.

Release Time:2019-03-25  Hits:

First Author: 李晓娜

Disigner of the Invention: 董闯,王清,朱瑾,张心怡

Authorization Number: US 9,023,271 B2

Prev One:一种用团簇固溶模型稳定N的高硬度Cu合金薄膜及其制备方法

Next One:一种具有高软化温度的Cu-Ni-Fe合金及其制备方法