Release Time:2019-03-25 Hits:
First Author: 李晓娜
Disigner of the Invention: 董闯,王清,朱瑾,张心怡
Authorization Number: US 9,023,271 B2
Prev One:一种用团簇固溶模型稳定N的高硬度Cu合金薄膜及其制备方法
Next One:一种具有高软化温度的Cu-Ni-Fe合金及其制备方法