Release Time:2019-03-12  Hits:

Indexed by: Conference Paper

Date of Publication: 2006-01-01

Included Journals: CPCI-S

Page Number: 307-312

Key Words: microgripper; UV-LIGA; SU-8 photoresist; electroplating

Abstract: In the work presented in this article a compliant nickel electro-thermal microgripper was designed using topology optimization and a fabrication process for the high aspect ratio metal microgripper has been developed using UV-LIGA technology with photoresist EPON SU-8. An electro-thermal microgripper with the smallest feature size of 10 mu m and thickness of 40 mu m and low internal stress was gained. Final dynamic performance of the nickel microgripper was experimented within Ov similar to 2.5v range. The tweezing displacement of up to 67 mu m at 2.5v was recorded. Characterized structures behaved in accordance with the intended behaviors.