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Indexed by:会议论文

Date of Publication:2006-01-01

Included Journals:CPCI-S

Page Number:307-312

Key Words:microgripper; UV-LIGA; SU-8 photoresist; electroplating

Abstract:In the work presented in this article a compliant nickel electro-thermal microgripper was designed using topology optimization and a fabrication process for the high aspect ratio metal microgripper has been developed using UV-LIGA technology with photoresist EPON SU-8. An electro-thermal microgripper with the smallest feature size of 10 mu m and thickness of 40 mu m and low internal stress was gained. Final dynamic performance of the nickel microgripper was experimented within Ov similar to 2.5v range. The tweezing displacement of up to 67 mu m at 2.5v was recorded. Characterized structures behaved in accordance with the intended behaviors.