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Indexed by:期刊论文

Date of Publication:2012-11-01

Journal:JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Included Journals:SCIE、EI、Scopus

Volume:212

Issue:11

Page Number:2315-2320

ISSN No.:0924-0136

Key Words:Multilayer microfluidic chip; Embedded sacrificial layer; Laser edge welding; PMMA

Abstract:"Reservoir unsealed" and "boundary layer separation" are two main issues in the fabrication of a multilayer poly(methyl methacrylate) (PMMA) microfluidic chip. In this paper, embedded sacrificial layer bonding (ESLB) and laser edge welding (LEW) are presented to avoid them. ESLB is performed by inserting a sacrificial-layer into a reservoir to enhance the transfer of bonding pressure among different layers. LEW is performed by using CO2 laser to weld the edge of a bonded multilayer chip. By using these two methods, a three-layer microchip and a five layer micro-mixer are fabricated. Our results demonstrated that ESLB and LEW can be implemented readily in the fabrication of a multilayer thermoplastic microfluidic chip which may facilitate the development of sophisticated microfluidic systems. (C) 2012 Elsevier B.V. All rights reserved.