Hits:
First Author:wangdazhi
Disigner of the Invention:Chong Liu,Junsheng Liang,daihengzhen,wangliding,songxiaowei,rentongqun,王珂,Xue Song
Application Number:CN201210199354.4
Authorization Date:2012-06-15
Authorization number:CN102721501A
Pre One:集成厚度可控绝缘层的非接触电导检测微芯片制作方法
Next One:一种LED器件的硅基板与铜微热管集成制造方法
