沉陷铜电极电化学微流控芯片的制备方法
Release Time:2019-03-09 Hits:
First Author: 罗怡
Disigner of the Invention: 杜立群,王立鼎,Chong Liu,刘军山,王晓东
Application Number: CN200410082842.2
Authorization Date: 2004-12-01
Authorization Number: CN1641346
Release Time:2019-03-09 Hits:
First Author: 罗怡
Disigner of the Invention: 杜立群,王立鼎,Chong Liu,刘军山,王晓东
Application Number: CN200410082842.2
Authorization Date: 2004-12-01
Authorization Number: CN1641346