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一种用于POCT芯片产品精密超声波焊接的接头结构

Release Time:2019-03-09  Hits:

First Author: 李经民

Disigner of the Invention: 王立鼎,刘军山,梁超,Chong Liu,周利杰

Application Number: CN201510623609.9

Authorization Date: 2015-09-25

Authorization Number: CN105109034A

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