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一种用于POCT芯片产品精密超声波焊接的压力自适应装置

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First Author:李经民

Disigner of the Invention:周立杰,Chong Liu,梁超,liujunshan,wangliding

Application Number:CN201510350252.1

Authorization Date:2015-06-19

Authorization number:CN104985807A

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