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一种用于POCT芯片产品精密超声波焊接的压力自适应装置

Release Time:2019-03-09  Hits:

First Author: 李经民

Disigner of the Invention: 王立鼎,刘军山,梁超,Chong Liu,周立杰

Application Number: CN201510350252.1

Authorization Date: 2015-06-19

Authorization Number: CN104985807A

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