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论文类型：期刊论文

发表时间：2018-01-01

发表刊物：MATERIALS SCIENCE AND TECHNOLOGY

收录刊物：SCIE

卷号：34

期号：7

页面范围：862-868

ISSN号：0267-0836

关键字：Copper alloy; recovery; recrystallisation; texture; mechanical stress field

摘要：The Influence of the mechanical stress much lower than the yield stress during annealing on the annealing behaviour of cold-rolled Cu-Ag alloy was investigated. The optical microscopy, X-ray diffraction and electron backscatter diffraction (EBSD) were used to characterise the microstructure and texture. When such annealing of cold-rolled Cu-Ag alloy is conducted under uniaxial tensile stress, an analysis of the work hardening behaviour and microstructural evolution indicated that the presence of uniaxial tensile stress during annealing retards recrystallisation. EBSD studies also revealed that the dislocation density of the sample annealed under stress is lower than that after cold-rolled. The retardation of recrystallisation is associated with the reduction of the dislocation density of un recrystal Used cold-rolled Cu-Ag alloy induced by dynamic recovery.