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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
Friction-based in Situ Endpoint Detection of Copper CMP Process
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论文类型：会议论文
发表时间：2008-09-20
收录刊物：EI、CPCI-S
卷号：53-54
页面范围：125-130
关键字：Chemical mechanical polishing (CMP); Endpoint detection (EPD); Friction
摘要：Chemical mechanical polishing (CMP) has been extensively used in the integrate circuit (IC) manufacturing industry as a widely accepted global planarization technology, accurate in situ endpoint detection of CMP process can reduce the product variance, significantly improve yield and throughput. A CMP in situ endpoint detection system, which measured the friction and downforce during CMP process using a specially designed three-axis strain gauge force sensor, was developed. The frictional transition from copper (Cu) to tantalum (Ta) barrier as well as Ta barrier to silicon dioxide (SiO2) dielectric was detected during CMP process. The experimental results showed that the change of friction could be detected when the polished material changed. The developed CMP in situ endpoint detection system is feasible for 300 mm and 450 mm copper CMP process.