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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
Material removal mechanism of chemo-mechanical grinding (CMG) of Si wafer by using soft abrasive grinding wheel (SAGW)
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论文类型：期刊论文
发表时间：2009-01-01
发表刊物：Key Engineering Materials
收录刊物：EI、Scopus
卷号：389-390
页面范围：459-464
ISSN号：10139826
摘要：An innovative fixed abrasive grinding process of chemo-mechanical grinding (CMG) by using soft abrasive grinding wheel (SAGW) has been recently proposed to achieve a damage-free ground workpiece surface. The basic principle, ideas and characteristics of CMG with SAGW are briefly introduced in this paper. The CMG experiments using newly developed SAGW for Si wafer are conducted at the condition of dry grinding. The grinding performances are evaluated and analyzed in terms of surface roughness, surface topography and surface/subsurface damage of ground wafer by use of Zygo interferometer, Scanning Electron Microscope (SEM) and Cross-section Transmission Electron Microscope (Cross-section TEM). The component of product of ground Si surface is studied by X-ray Photoelectron Spectroscopy (XPS) to verify chemical reaction between the abrasive / additives of grinding wheel and Si wafer. The CMG process model by using SAGW is developed to understand the material removal mechanism and generation principle of damage-free surface. The study results show that the material removal mechanism of CMG by using SAGW can be explained as a hybrid process of chemical and mechanical action.