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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates
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论文类型：期刊论文
发表时间：2017-01-25
发表刊物：MATERIALS AND MANUFACTURING PROCESSES
收录刊物：SCIE、EI、Scopus
卷号：32
期号：2
页面范围：121-126
ISSN号：1042-6914
关键字：Damage; diamond; efficiency; grinding; mechanism; removal; sapphire; subsurface; surface; topography; wafer
摘要：In order to improve machining efficiency of sapphire wafer machining using the conventional loose abrasive process, fixed-abrasive diamond plates are investigated in this study for sapphire wafer grinding. Four vitrified bond diamond plates of different grain sizes (40 mu m, 20 mu m, 7 mu m, and 2.5 mu m) are developed and evaluated for grinding performance including surface roughness, surface topography, surface and subsurface damage, and material removal rate (MRR) of sapphire wafers. The material removal mechanisms, wafer surface finish, and quality of the diamond plates are also compared and discussed. The experiment results demonstrate that the surface material is removed in brittle mode when sapphire wafers are ground by the diamond plates with a grain size of 40 mu m and 20 mu m, and in ductile mode when that are ground by the diamond plates of grain sizes of 7 mu m and 2.5 mu m. The highest MRR value of 145.7 mu m/min is acquired with the diamond plate with an abrasive size of 40 mu m and the lowest surface roughness values of 3.5nm in Ra is achieved with the 2.5 mu m size.