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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
Analysis of the polishing ability of electrogenerated chemical polishing
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论文类型：期刊论文
发表时间：2017-01-01
发表刊物：PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
收录刊物：SCIE、EI
卷号：47
页面范围：122-130
ISSN号：0141-6359
关键字：Electrochemistry; Chemical polishing; Roughness; Polishing ability; Numerical simulation
摘要：Electrogenerated chemical polishing (EGCP) had been proved ffective in improving both the smoothness and the flatness of copper surface in our previous work. In this paper the polishing ability, defined as the ratio between the material removal rate at the peak and at the valley of a rough surface, is studied theoretically and experimentally. In a mathematical model, the effects of the special wavelength L, the peak -to -valley height h of the workpiece surface profile and the working distance d between working electrode and workpiece surface on the polishing ability are studied. The results show that the polishing ability decreases with increasing the working distance and finally approaches the value (d+h)/d, if L is much larger than d. However, the effect of the working distance on polishing ability is negligible, if L is close to or less than d. The polishing ability also decreases with h decreasing. Based on the above analysis, an analytical expression of the polishing ability of EGCP is given. For validating the theoretical analysis, a copper surface is polished by EGCP and the change of the surface profile is measured and analyzed using the analytical expression. The measured polishing ability agrees well with the simulation results. (C) 2016 Elsevier Inc. All rights reserved.