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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
A new method for measuring the flatness of large and thin silicon substrates using a liquid immersion technique
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论文类型：期刊论文
发表时间：2015-11-01
发表刊物：MEASUREMENT SCIENCE AND TECHNOLOGY
收录刊物：SCIE、EI、Scopus
卷号：26
期号：11
ISSN号：0957-0233
关键字：thin substrate; wafer; flatness measurement; liquid immersion
摘要：Flatness measurements of thin and large substrates are greatly affected by gravity. In this work, a new method was proposed for accurately measuring the flatness error of large and thin silicon wafers using a floating technique. In this method, a silicon wafer was immersed in a liquid that had a density slightly lower than that of silicon and was supported by three ball supporters in the liquid. The wafer shape was measured using a laser triangulation sensor. The buoyancy force on the wafer inside the liquid could cancel out most of the effect of gravity. The residual effect of gravity was further removed by subtracting the residual deflection calculated by finite-element modeling from the measured result. The method was validated by comparing the flatness values of a thick wafer measured using this method and via a commercially available interferometer. The deformations of wafers ground by #600 and #2000 diamond wheels were measured and the measurement error was less than 3% of the total deformation.