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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers
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论文类型：期刊论文
发表时间：2013-03-01
发表刊物：INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
收录刊物：SCIE、EI
卷号：66
页面范围：54-65
ISSN号：0890-6955
关键字：Silicon wafer; Grinding marks; Cup wheel; Axial run out; Flatness; Waviness
摘要：A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness. In this paper, the grinding marks formation mechanism was clarified, a grinding marks formation model and an angular wavelength model were developed, and a grinding marks suppression method was proposed. A series of grinding experiments were carried out to verify the developed models and investigate the effect of the wafer rotational speed, the wheel rotational speed, the infeed rate, the axial run out of the cup wheel and the spark out time. The results show that: (1) grinding marks are waviness generated on silicon wafers caused by non-uniform material removal circumferentially due to the axial run out of the cup wheel; (2) grinding marks present multiple angular wavelengths characteristics; (3) the angular wavelength of grinding marks is a one-variable function of the rotational speed ratio of the wheel to the wafer; and (4) grinding marks could be suppressed significantly by properly selecting the rotational speed ratio. (C) 2012 Elsevier Ltd. All rights reserved.