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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 国际磨粒技术学会（International Committee of Abrasive Technology, ICAT）委员，中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员，中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员，中国机械工程学会特种加工分会超声加工技术委员会副主任，中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员，中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。
性别：男
毕业院校：西北工业大学
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 机械电子工程. 航空宇航制造工程
办公地点：机械工程学院7191
电子邮箱：kangrk@dlut.edu.cn
Modeling and investigation on wafer shape in wafer rotational grinding method
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论文类型：期刊论文
发表时间：2013-02-01
发表刊物：INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
收录刊物：SCIE、EI、Scopus
卷号：64
期号：5-8
页面范围：707-714
ISSN号：0268-3768
关键字：Silicon wafer; Ultra-precision grinding; Simulation; Wafer shape; Rotational grinding
摘要：With the fast development of the integrated circuits, the size of the wafer is getting larger and the demand for the wafer shape and flatness has become higher and higher. There are many factors which could influence the wafer shape. So in this paper based on the rotational coordinates method, a theoretical model of the ground wafer shape in wafer rotational grinding is firstly developed, in which the main factors were considered, including parameters of the dressing vacuum chuck and the wafer grinding, etc. Secondly, the simulation system was developed by Visual C++ and OpenGL according to the model, by which the simulation results of wafer shape could be made and the relationship between the wafer shape and parameters can be gotten. Finally, the experiments of wafer grinding were carried out on an ultra-precision grinder (VG401MKII), and the developed model is verified to be correct by comparing the experiment results and simulation results. The research indicates the wafer shape and flatness can be predicted exactly, and it is quite significant to choose the reasonable parameters to effectively control the wafer shape in the wafer rotational grinding. The total thickness variation can be controlled within 1 nm if the parameters are chosen reasonably.