康仁科

个人信息Personal Information

教授

博士生导师

硕士生导师

任职 : 国际磨粒技术学会(International Committee of Abrasive Technology, ICAT)委员,中国机械工程学会极端制造分会副主任、生产工程分会常务委员、微纳米制造技术分会常务委员,中国机械工程学会生产工程分会磨粒加工技术专业委员会副主任、切削加工专业委员会常委委员、精密工程与微纳技术专业委员会常委委员,中国机械工程学会特种加工分会超声加工技术委员会副主任,中国机械工程学会摩擦学分会微纳制造摩擦学专业委员会常务委员,中国机械工业金属切削刀具协会切削先进制造技术研究会常务理事、对外学术交流工作委员会副主任、切削先进制造技术研究会自动化加工技术与系统委员会副主任。

性别:男

毕业院校:西北工业大学

学位:博士

所在单位:机械工程学院

学科:机械制造及其自动化. 机械电子工程. 航空宇航制造工程

办公地点:机械工程学院7191

电子邮箱:kangrk@dlut.edu.cn

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Fabrication and Characterization of FeNiCr Matrix-TiC Composite for Polishing CVD Diamond Film

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论文类型:期刊论文

发表时间:2009-05-01

发表刊物:JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

收录刊物:SCIE、EI、ISTIC、Scopus

卷号:25

期号:3

页面范围:319-324

ISSN号:1005-0302

关键字:CVD diamond film; FeNiCr matrix-TiC composite; Spark plasma sintering; Mechanical alloying

摘要:Dynamic friction polishing (DFP) is one of the most promising methods appropriate for polishing CVD diamond film with high efficiency and low cost. By this method CVD diamond film is polished through being simply pressed against a metal disc rotating at a high speed utilizing the thermochemical reaction occurring as a result of dynamic friction between them in the atmosphere. However, the relatively soft materials such as stainless steel, cast iron and nickel alloy widely used for polishing CVD diamond film are easy to wear and adhere to diamond film surface, which may further lead to low efficiency and poor polishing quality. In this paper, FeNiCr matrix-TiC composite! used as grinding wheel for polishing CVD diamond film was obtained by combination of mechanical alloying (MA) and spark plasma sintering (SPS). The process of ball milling, composition, density, hardness, high-temperature oxidation resistance and wear resistance of the sintered piece were analyzed. The results show that TiC was introduced in MA-SPS process and had good combination with FeNiCr matrix and even distribution in the matrix. The density of composite can be improved by mechanical alloying. The FeNiCr matrix-TiC composite obtained at 1273 K was found to be superior to at 1173 K sintering in hardness, high-temperature oxidation resistance and wearability. These properties are more favorable than SUS304 for the preparation of high-performance grinding wheel for polishing CVD diamond film.