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Indexed by:期刊论文

Date of Publication:2010-05-01

Journal:COMPOSITE STRUCTURES

Included Journals:SCIE、EI

Volume:92

Issue:6

Page Number:1410-1415

ISSN No.:0263-8223

Key Words:Piezoelectric; Interface crack; Debonding; Interface element; Adhesive

Abstract:This paper studies interfacial debonding behavior of composite beams which include piezoelectric materials, adhesive and host beam. The focus is put on crack initiation and growth of the piezoelectric adhesive interface. Closed-form solutions of interface stresses and energy release rates are obtained for adhesive layer in the piezoelectric composite beams. Finite element analyses have been carried out to study the initiation and growth of interfaces crack for piezoelectric beams with interface element by ANSYS, in which the interface element of FE model is based on the cohesive zone models to characterize the fracture behavior of the interfacial debonding, The results have been compared with analytical solution, and the influence of different geometry and material parameters on the interfacial behavior of piezoelectric composite beams have been discussed. (C) 2009 Elsevier Ltd. All rights reserved.