白瑞祥

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:力学与航空航天学院

学科:机械设计及理论. 计算力学. 工程力学

办公地点:力学楼322

联系方式:15668619873

电子邮箱:bairx@dlut.edu.cn

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Noncontact optical measurement of CTOA and CTOD for interface crack in DCB test

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论文类型:期刊论文

发表时间:2012-07-01

发表刊物:OPTICS AND LASERS IN ENGINEERING

收录刊物:SCIE、EI

卷号:50

期号:7

页面范围:964-970

ISSN号:0143-8166

关键字:CTOA; CTOD; DCB; DIC

摘要:The crack-tip opening angle (CTOA) and the crack-tip opening displacement (CTOD) are used as fracture parameters for characterizing the resistance of a material to fracture and predicting the instability of crack propagating fracture process. Digital image correlation method (DIC) was used to measure the displacement fields in a double cantilever beam (DCB) test with an initial interfacial crack. An apparent crack-tip was determined using the y-displacement along two parallel lines of the two crack flanks, which in turn enables the CTOA and CTOD to be evaluated. The experimental results revealed that the extension process for interface crack is divided into stable and unstable crack extension phases which changed alternately in the DCB test. The crack growth rate (CGR) varied from one stable phase to another, but was a constant value within each stable phase. The CGR, however, increased gradually over time within the unstable phases. The CTOA and CTOD did not increase synchronously in the loading process: the CTOA begins to increase at the first stable crack growth phase, whereas, the CTOD increased rapidly with the CTOA until entered into the second phase of unstable crack propagation. The above crack propagation behaviour on the bi-material corresponds to the interface crack transition, which is transformed from the tearing crack Mode I gradually into the mixed Mode I/II crack form. (C) 2012 Elsevier Ltd. All rights reserved.