点击次数：

论文类型：期刊论文

发表时间：2010-05-01

发表刊物：COMPOSITE STRUCTURES

收录刊物：SCIE、EI

卷号：92

期号：6

页面范围：1410-1415

ISSN号：0263-8223

关键字：Piezoelectric; Interface crack; Debonding; Interface element; Adhesive

摘要：This paper studies interfacial debonding behavior of composite beams which include piezoelectric materials, adhesive and host beam. The focus is put on crack initiation and growth of the piezoelectric adhesive interface. Closed-form solutions of interface stresses and energy release rates are obtained for adhesive layer in the piezoelectric composite beams. Finite element analyses have been carried out to study the initiation and growth of interfaces crack for piezoelectric beams with interface element by ANSYS, in which the interface element of FE model is based on the cohesive zone models to characterize the fracture behavior of the interfacial debonding, The results have been compared with analytical solution, and the influence of different geometry and material parameters on the interfacial behavior of piezoelectric composite beams have been discussed. (C) 2009 Elsevier Ltd. All rights reserved.